(adsbygoogle = window.adsbygoogle || []).push({}); So when I pulled apart this PS3 the thermal paste was dried on really hard. It took me a solid 30 minutes to separate the CPU and GPU from the heatsinks. Anyway I think I may have lifted the CPU slightly up in the proccess. Should I put weights or something to push the CPU back down and then reflow?
I need this console working, if not I can get it reballed somewhere. Reason is because it is running firmware ver 3.21.

Most likely you need to reball it did you chip or damage anything on the mother board

I only slightly raised the CPU in the process of removing the heatsink. The console was first opened by me and that is why the thermal paste was so dry.

The CPU and GPU have a kind of cover over them, maybe that is what you pulled up, because to yank the CPU off the board without it being hot is a very hard thing to do.

I was trying and trying to pull the heatsinks off for at least 30 minutes. Then gave up and tried 5 hours later and finally got it off after another 10 minutes of trying. I think all the effort I used to try and get it off may have ruined a solder on the CPU somewhere. I think the only fix for the console is a reball.